Just FYI, the tick-tock model followed by Intel doesn’t directly have anything to do with sockets and pin outs.

The tick-tock model meant that after each change of the microarchitecture was followed by a die shrink. While a new socket is likely a consequence of these changes, it is a necessary byproduct rather than an intentional change.

Furthermore, Intel hasn’t used the tick-tock model since 2016.

However, trying to compare terrestrial consumer hardware with rugged radiation hardened hardware is futile. They have drastically different design/engineering specs that have hard limits with respect to physics, even special process nodes for true radiation hardening (RHBP). I think they’re only 150nm, I want to say there were some RHBP 65nm FPGAs recently, but I’m not 100%.

I have a feeling though if NASA were to make components, they’d all just be specialized embedded systems rather than anything consumer or enterprise. After all, computers are but tools to do different jobs.